JPH0358085B2 - - Google Patents
Info
- Publication number
- JPH0358085B2 JPH0358085B2 JP58211285A JP21128583A JPH0358085B2 JP H0358085 B2 JPH0358085 B2 JP H0358085B2 JP 58211285 A JP58211285 A JP 58211285A JP 21128583 A JP21128583 A JP 21128583A JP H0358085 B2 JPH0358085 B2 JP H0358085B2
- Authority
- JP
- Japan
- Prior art keywords
- ball lens
- hole
- lens
- diameter
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58211285A JPS60102605A (ja) | 1983-11-10 | 1983-11-10 | 光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58211285A JPS60102605A (ja) | 1983-11-10 | 1983-11-10 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60102605A JPS60102605A (ja) | 1985-06-06 |
JPH0358085B2 true JPH0358085B2 (en]) | 1991-09-04 |
Family
ID=16603396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58211285A Granted JPS60102605A (ja) | 1983-11-10 | 1983-11-10 | 光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60102605A (en]) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61187154A (ja) * | 1985-02-14 | 1986-08-20 | Matsushita Electric Ind Co Ltd | テ−プ・ガイド装置 |
JPH043284Y2 (en]) * | 1985-02-25 | 1992-02-03 | ||
FR2593930B1 (fr) * | 1986-01-24 | 1989-11-24 | Radiotechnique Compelec | Dispositif opto-electronique pour montage en surface |
JPH075647Y2 (ja) * | 1987-07-13 | 1995-02-08 | 沖電気工業株式会社 | 光半導体結合器 |
JP4795551B2 (ja) * | 2001-03-09 | 2011-10-19 | 三菱電機株式会社 | 光半導体装置用キャップとこれを用いた光半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56172811U (en]) * | 1980-05-21 | 1981-12-21 |
-
1983
- 1983-11-10 JP JP58211285A patent/JPS60102605A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60102605A (ja) | 1985-06-06 |
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